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Low temperature direct bonding for hermetic wafer level packaging
  • 所属机构名称：湖北工业大学
  • 会议名称：4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2009
  • 成果类型：会议
  • 会场：Shenzhen, China
  • 相关项目：面向三维集成器件封装的无焊料高密度通孔垂直互连技术研究
作者： Liu, Shiyuan|Tang, Zirong|Nie, Lei|Liao, Guanglan|Shi, Tielin|
同会议论文项目
面向三维集成器件封装的无焊料高密度通孔垂直互连技术研究
期刊论文 15 会议论文 6 专利 6
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