中文摘要：

Cu3Ti 合金的微观结构和性质上的 Ni 增加和老化处理的效果被调查。微观结构和降水阶段被 X 光检查衍射描绘，扫描电子显微镜学，和传播电子显微镜学；产生合金的坚硬，电的传导性，和有弹性的模量也被测试。结果证明 Ni 增加增加电的传导性和有弹性的模量，但是减少年老的 Cu3Ti 合金的坚硬。在试验性地调查的参数的范围以内，为 Cu3Ti1Ni 和 Cu3Ti5Ni 合金的最佳的二阶段的老化处理是 300

英文摘要：

The effects of Ni addition and aging treatments on the microstructure and properties of a Cu–3Ti alloy were investigated. The microstructure and precipitation phases were characterized by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy; the hardness, electrical conductivity, and elastic modulus of the resulting alloys were also tested. The results show that Ni addition increases the electrical conductivity and elastic modulus, but decreases the hardness of the aged Cu–3Ti alloy. Within the range of the experimentally investigated parameters, the optimal two-stage aging treatment for the Cu–3Ti–1Ni and Cu–3Ti–5Ni alloy was 300℃ for 2 h and 450℃ for 7 h. The hardness, electrical conductivity, and elastic modulus of the Cu–3Ti–1Ni alloy were HV 205, 18.2% IACS, and 146 GPa, respectively, whereas the hardness, electrical conductivity, and elastic modulus of the Cu–3Ti–5Ni alloy were HV 187, 31.32% IACS, and 147 GPa, respectively. Microstructural analyses revealed that β′-Ni3 Ti and β′-Cu4 Ti precipitate from the Cu matrix during aging of the Cu–3Ti–5Ni alloy and that some residual Ni Ti phase remains. The increased electrical conductivity is ascribed to the formation of Ni Ti, β′-Ni3 Ti, and β′-Cu4 Ti phases.