中文摘要：

采用直流磁控溅射工艺实现了PZT压电蜂鸣片的金属化,分别研究了Cr/Cu/Ag、Ti/Cu/Ag、Cu/Ag3种复合膜系电极薄膜的微观结构和电学性能差异,并与“丝网印刷银浆再高温烧结”（简称“丝印烧结”）金属化工艺进行了比较.研究结果表明,用溅射金属化工艺制备的压电蜂鸣片,其电极膜层致密、均匀,一致性好,电学性能普遍优于丝印烧结工艺,其中又以Ti/Cu/Ag 膜系为最佳,最大抗拉强度达到13.5MPa、平均谐振电阻小于25Ω、机电耦合系数大于0.7,而金属化膜厚仅为丝印烧结工艺的1/4,另外电容量和谐振频率等指标均符合蜂鸣器的标准,各项性能全面优于丝印烧结金属化工艺,具有全过程无污染、生产成本低、可控性强,适合于产业化生产等优点,可以取代丝印烧结工艺.

英文摘要：

We proposed a novel metallization process for PZT piezoelectric buzzers using direct-current (DC) magnetron sputtering method,and compared it to the traditional screen-printed method Three groups of sam-ples with different sputtering processes were investigated,namely Cr/Cu/Ag,Ti/Cu/Ag and Cu/Ag multilayer structures.The micro-structure of surface and cross-section view of metallized films were analyzed by scanning electron microscopy (SEM),other aspects,such as adhesion and electric characteristics were also investigated. Results show that the performance of films prepared by magnetron sputtering method has surpassed those by screen-printed method in all aspects.The proposed method provides more dense,uniform,and conformal films than the traditional one,and the Ti/Cu/Ag structure shows the best performance owing to the matching of ma-terials between Ti glue layer and PZT substrate.The largest tensile strength reaches 13.5 MPa,and the mean resonant resistance and electromechanical coupling coefficient are 25 Ωand 0.7,respectively,which are better than those of screen-printed ones.Additionally,the thickness of metallized film of magnetron sputtering is only about 1 .7 micron that is much less than the screen-printed one.Due to the good performance,low-cost as well as non-pollution,the magnetron sputtering show promising applications in piezoelectric buzzer and other PZT based devices.