中文摘要：

摘要：为探讨机器人果实采摘中应用激光进行果梗切断的可行性，以黄瓜果梗为对象，利用基于30w光纤耦合半导体激光器构建的果梗切割实验平台，分别进行了激光穿透时间与果梗直径、激光束功率、离焦量、入射角的关系实验和果梗激光切割速度实验。实验发现，激光焦斑热功率密度0．75W／mm2。即可实现果梗的穿透和切割，且对果梗直径变化、焦斑定位与入射角度误差具有良好的适应性。但半导体激光器在垂直照射、零离焦量、光输出功率14．94W条件下的最短切割时间达到23．73～28．13s，应通过选择更高光束质量的光纤激光器等实现快速气化切割以满足实际作业的需要。

英文摘要：

With the aim to verify the feasibility of cutting peduncles with laser beam in harvesting robot, several laser drilling and cutting experiments of cucumber peduncles were conducted with a 30 W fiber- coupled semiconductor laser in view of different factors. It was found that the laser focusing spot with heat power density of only 0.75 W/mm2 could drill through a cucumber peduncle, and a successful drilling could be achieved even if diameter of peduncles, defocusing distance, or incident angle of laser beam changed within a large range. However, 23.73 - 28. 13 s was necessary to cut a cucumber peduncle when pointing a 14.94 W semiconductor laser beam vertically without any defocus at the peduncle ~urface. It is not an ideal vaporizing but a burning process to cut peduncles attributed to the much worse beam quality of semiconductor laser, and it is believed that a Nd：YAG speed cuttin~ of peduncles, which can sunnlv 102 - 103 rimo~ hi~,h,,- h,-~t or fiber laser can achieve high