中文摘要：

采用266 nm或355 nm的紫外激光器可以对微小的金属薄膜器件直接进行激光精密加工。但是，目前紫外激光器的输出功率普遍较低，以至于还不能对大幅面、深尺度的光泽金属进行激光加工。为了克服光泽金属对大功率固体激光器输出的1064 nm激光的高反射率和散热快问题，采用了优化谐振腔和扫描聚焦系统的光学方法，实现了激光单模运转，功率密度达到了1.592×109 W/cm2，由此也使得加工工件通过原子吸收激光能量的方式改变为通过金属中的自由电子的等离子体激射来吸收激光能量。在平均功率为50 W、重复频率为500 Hz、焦斑直径小于20μm、脉冲宽度为80 ns、切割速度为10 mm/s的加工条件下，对厚度为10 mm的大尺寸紫铜板直接进行了激光精密刻蚀实验，切割的槽宽和槽深均为100±10μm；槽间距为300±15μm，均达到了初始设计的指标要求。

英文摘要：

Micro devices of metal thin film may be directly processed by utilizing the UV laser at the wavelegth of 266 nm or 355 nm. However, due to the output power of UV laser is common lower at present, it is not suitable for directly processing the shine metal with the larger size and thick. In this experiment, in order to overcome the problems that shine metal possess the high reflectivity to the solid state laser of high power at 1 064 nm and the fast heat dissipation, the resonant cavity and the scanning focusing system were optimized, then the laser single mode operation was realized and the power density was reached 1.592í109 W/cm2, which also make that the absorption of laser energy by atom changes into the absorption way by the plasma emission of the free electrons in the metal. Utlizing to the laser of average power of 50 W, repetition frequency of 500 Hz, spot diameter of 20μm, pulse duration of 80 ns, cutting velocity of 10 mm/s, the bigger copperplate with thick of 10 mm was directly processed accurately, the width and deepth of the groove by laser cutting were all 100±10μm, and the groove spacing was 300±15μm, that were enough satisfied the initial target.