合成了含有苯乙炔基的二胺单体3,5-二氨基-4'-苯乙炔苯甲酮(DPEB),并与3,3',4,4'-联苯四酸二酐(s-BPDA)和1,4-双(4'-氨基苯氧基)-2-(苯基)苯(p-TPEQ)进行了缩聚反应,以4-苯乙炔苯酐作为封端剂,合成了交联侧基苯乙炔封端酰亚胺预聚体(n=4).DSC测试结果表明,引入交联侧基后预聚体依然保持着较宽的加工窗口.利用所合成的预聚体在370℃热压1 h制备了热固性薄膜.DMA测试结果表明,引入交联侧基的预聚体树脂具有更高的玻璃化转变温度,并且其储存模量在玻璃化转变后有很好的保持.
A diamine monomer 3,5-diamino-4'-phenylethynylbenzophenone (DPEB) was synthesized and phenylethynyl-terminated imide oligomers having pendent phenylethynyl group (rt = 4) was prepared by the reaction of 3,3', 4,4'-biphenylenetetracarboxylic dianhydride ( s-BPDA ), DPEB and 2,5-bis ( 4-aminophenoxy)-biphenyl(p-TPEQ), and end-capped with 4-phenylethynylphthalic anhydride (PEPA). The imide oli gomer had low Tg and pro, eided wide processing window. The cured films were prepared by molding the oligomer powder at 370 °C for 1 h under pressure. DMA results show tile introduction of pendent phenylethynyl group increases Ts of the cured film and the retention of storage modulus beyond Ts is promoted.