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Economizing TSV resources in 3D Network-on-Chip design
  • 期刊名称：IEEE Transactions on Very Large Scaled Integration
  • 时间：2015.3.1
  • 页码：493-506
  • 相关项目：超并行高效能计算机体系结构与设计方法研究
作者： Lei Zhang|Yinhe Han|Huawei Li|Xiaowei Li|
同期刊论文项目
超并行高效能计算机体系结构与设计方法研究
期刊论文 124 会议论文 114
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