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Microstructure Modeling for Prediction of Thermal Conductivity of Plain Weave C-SiC Fiber Bundles Co
Microstructure modeling for prediction of thermal expansion coefficient of plain weave C/SiC conside
Microstructure modeling for prediction of thermal conductivity of plain weave C/SiC composites consi
Study on the influence of manufacturing defects on coefficient of thermal expansion of plain weave C
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