位置：成果数据库 > 期刊 > 期刊详情页
Microstructure modeling for prediction of thermal expansion coefficient of plain weave C/SiC conside
  • ISSN号：1022-6680
  • 期刊名称：Advanced Materials Research
  • 时间：2011.11.11
  • 页码：315-319
  • 相关项目：基于细观力学的C/SiC高温应力氧化性能数值考核
作者： Lv Shengli|Zeng Qingna|Yao Leijiang|Tong Xiaoyan|
同期刊论文项目
基于细观力学的C/SiC高温应力氧化性能数值考核
期刊论文 14 会议论文 1
同项目期刊论文
Microstructure Modeling for Prediction of Thermal Conductivity of Plain Weave C-SiC Fiber Bundles Co
Microstructure modeling for prediction of thermal conductivity of plain weave C/SiC composites consi
Study on the influence of manufacturing defects on coefficient of thermal expansion of plain weave C
Validity of several NDT methods on low velocity impact damage evaluation of 2-dimensional plain wove
Microstructure Modeling and Further Effective Property Prediction for Plain Weave C/SiC Composites C
2D C/SiC 复合材料蠕变寿命分布规律研究
二维C-SiC复合材料的室温疲劳行为及寿命预测
2D C/SiC拉伸损伤的声发射信号聚类分析
初始缺陷对平纹编织复合材料热膨胀系数的影响
2D—C／SiC拉伸损伤的声发射信号聚类分析
初始缺陷对平纹编织C/SiC复合材料热膨胀系数的影响
2DC／SiC复合材料蠕变寿命分布规律研究
平纹编织C/SiC复合材料精细RVE的建立