应用激光微冲击强化处理技术,对不同磁控溅射参数下制备的纳米铜薄膜进行了强化处理,并对其表面形貌、硬度、弹性模量进行了测试和分析.结果表明:纳米铜薄膜经激光微冲击处理后,SEM显示薄膜表层的铜晶粒发生了明显的塑性形变,在厚度方向上被压平,晶粒边界处的细小空隙被填充,表面变得致密,颗粒尺寸明显增大.在每组试样的冲击区和非冲击区进行了多组纳米压痕试验,以确定冲击后铜薄膜力学性能的变化.经测试,各组试样冲击处理的条件不同,薄膜力学性能变化有所差异;硬度最小的也增加了38.84%,硬度增加最大的达到106.58%;弹性模量最小提高了14.62%,弹性模量最大提高了134.82%.
Laser shock processing was used to treat nanometer copper thin films at different magnetron sputtering parameters.The hardness,elastic modulus and surface topography of the films were determined and analyzed.The results indicate that after laser shock processing,nanometer crystals on the surface of copper thin film present obvious plastic deformation from SEM image.The tiny vacancy at the grain boundary are filled with flat and dense surface,and the size of crystals is increased after treatment.Nanoindentation tests were conducted on different sample sets at shock area and untreated area.The samples were treated at different condition to give different changes of mechanical properties.The minimum change of film hardness is 38.84%,and the maximum change of that reaches 106.58%.The minimum change of film elastic modulus is 14.62% with maximum change of 134.82%.