中文摘要：

采用直流磁控溅射法,以高纯铝（99．99％）为靶材,高纯氩气（99．999％）为起辉气体,在经机械抛光的单晶 Si 衬底上制备铝纳米颗粒薄膜.利用 X 射线衍射仪（XRD）、光学薄膜测厚仪、扫描电子显微镜（SEM）和四探针测试仪分别测试了铝纳米颗粒薄膜的晶相结构、薄膜厚度、表面形貌及电阻率.XRD 衍射图谱表明此薄膜为面心立方的多晶结构,择优取向为Al（111）晶面.随溅射功率由30W 增至300W,铝纳米颗粒薄膜的沉积速率由3．03nm/min 增加至20．03nm/min；而随溅射压强由1Pa 增加至3 Pa,沉积速率由2．95nm/min 降低到1．66nm/min.在溅射功率为150 W,溅射压强为1．0 Pa 条件下制备的样品具有良好的晶粒分布.随溅射功率从80W 增大到160W,样品电阻率由4．0×10^－7Ω·m 逐渐减小到1．9×10^－7Ω·m；而随溅射压强从1Pa 增至3Pa,样品电阻率由1．9×10^－7Ω·m 增加到7．1×10^－7Ω·m.

英文摘要：

Aluminum nano-particle films are successfully deposited on mechanically polished monocrystal silicon substrates by DC magnetron sputtering,where the highly pure aluminum（99.99%）was used as target with the argon（99.999%）as sputtering gas.The crystal structure,thickness,surface morphology and electrical resistivi-ty were studied by X-ray diffraction （XRD）,optical thickness measuring,scanning electron microscopy （SEM） and four point probes meter,respectively.The XRD pattern showed that these Al nano-particle films had pre-ferred orientation of Al （111 ）with fcc polycrystal structure.When sputtering power increased from 30 to 300W,The deposition rate increased from 3.03 to 20.03 nm/min,while decreased from 2.95 to 1.66nm/min when the sputtering pressure increased from 1 to 3Pa.SEM images of surface morphology showed that the Al nano-particle films sputtered at 150 W and 1 Pa were perfect.With the sputtering power increased from 80 W to 1 60 W,the electrical resistivity decreased from 4.0 ×10^-7 Ω·m to 1.9×10^ -7 Ω·m,while increased from 1.9×10 -7 Ω·m to 7.1 ×10 ^-7 Ω·m with the sputtering pressure increasing from 1 Pa to 3 Pa.