中文摘要：

镍合金和铂合金靶材是电子半导体行业重要的镀膜材料。悁究镍合金和铂合金靶材对于改善薄膜质量和提高器件性能有重要意义。采用2种不同工艺制备了NiPt60%合金溅射靶材。使用金相显微镜（OM），扫描电子显微镜（SEM）和X射线衍射仪（XRD）观察并分析了磁控溅射前后靶材表面的形貌及结构。结果表明，采用热轧-热处理制备的靶材晶粒粗大但均匀，平均晶粒尺寸约为100μm；采用温轧-热处理制备的靶材细小但不均匀，平均晶粒尺寸约为50μm。溅射后的靶材形貌与晶粒尺寸和分布息息相关。

英文摘要：

Ni and Pt based alloys sputtering targets are important materials for film manufacture in electronic and semiconductor industry. Research on Ni and Pt based alloys are very important to improve the performance of related film and units.The morphology and microstructure of NiPt60% targets manufactured by two different methods before and after sputtering are observed by OM, SEM and XRD. The results show target processed by hot rolling and heat treatment has coarse but uniform microstructure, the average grain size of which are about 100 μm; target processed by warm rolling and heat treatment has small and less uniform microstructure, the average grain size of which are about 50 μm. The morphology of targets after sputtering is decided by the microstructure of alloy before sputtering.