磁控溅射是现代最重要的镀膜方法之一,具有简单,控制工艺参数精确和成膜质量好等特点。然而也有靶材利用率低、成膜速率低和离化率低等缺点。研究表明磁场结构对上述问题有重要影响,本文介绍了一种磁控溅射靶磁路优化设计方案。并对改进的磁场结构和一般的磁场结构进行了分析比较,并给出了实验结果。
Magnetron sputtering process is one of the recently important methods for thin film coating because of its simple and good controllability of process parameters and high quality. However, it has such shortcomings as low target utilization, low deposition rate and limited ionization, on which the magnetic field configuration has great influence. An optimized circuit design is therefore presented for the magnetron sputtering target, and it is compared with conventional ones with relevant experimental results given.