中文摘要：

针对半导体加工行业中高精度、高效率的特点，提出两类运动模式，一类是存在匀速段加工操作的工作运动，一类是为加工操作服务的准备运动。研究一种针对工作运动的三阶轨迹规划算法，确保被控对象能精确的以指定速度到达指定位置进行加工操作。在此基础上，通过重新计算已规划的切换时间实现相邻工作运动与准备运动的重叠，包括工作重叠准备之方向相同、工作重叠准备之方向相反、准备重叠工作之方向相同、准备重叠工作之方向相反4种重叠方式。实例证明上述算法具有较高的控制精度，能有效地提高生产效率，该算法已成功运用于半导体加工设备的控制中。

英文摘要：

Two motion modes are put forward for high precision and effectiveness in semiconductor manufacturing industry, one is work motion holding constant velocity process, the other is preparing motion serving for process before work motion. A third order profile planning algorithm is studied for work motion, which can guarantee the controlled object moving to an appointed position with an appointed velocity accurately. Then, through recalculating the switch times, the overlapping between preparing motion and work motion can be realized which include four conditions： work motion overlapping preparing motion in the same direction, work motion overlapping preparing motion in the opposite direction, preparing motion overlapping work motion in the same direction, and preparing motion overlapping work motion in the opposite direction. Finally, experimental results demonstrate that our method has extremely high precision and can highly promote the productivity using overlapping. Our method has been successfuUy applied in semiconductor equipments manufacturing.