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Study of Electromigration-inducedStress of Solder
  • ISSN号：1043-7398
  • 期刊名称：Journal of Electronic Packaging
  • 时间：2015.6.1
  • 页码：021006-1-021006-6
  • 相关项目：微尺度焊点在电迁移作用下变形行为的实验研究
作者： Fei Su, Weijia Li|
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微尺度焊点在电迁移作用下变形行为的实验研究
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