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Investigation on Hygro-thermo-mechanical Stress of a Plastic Electronic Package
  • ISSN号：1727-7191
  • 期刊名称：Journal of Mechanics
  • 时间：2014.12.1
  • 页码：625-630
  • 相关项目：微尺度焊点在电迁移作用下变形行为的实验研究
作者： Fei Su|Weijia Li,Wei Shang|
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