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Stress evaluation of through-silicon vias using micro-infrared photoelasticity andfinite element ana
  • 期刊名称：Optics and lasers in Engineering
  • 时间：2015.11.1
  • 页码：87-93
  • 相关项目：微尺度焊点在电迁移作用下变形行为的实验研究
作者： Fei Su, Tianbao Lan and Xiaoxu Pan|
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微尺度焊点在电迁移作用下变形行为的实验研究
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