中文摘要：

针对单晶硅这一典型硬脆材料的微磨削材料去除过程进行理论及试验分析,建立了单晶硅微磨削槽磨未变形切屑厚度数学模型,采用电镀金刚石微磨棒在精密微磨削机床上进行单晶硅的微尺度槽磨磨削试验。通过对试验结果的分析给出单晶硅微尺度磨削中边缘裂纹宽度随加工参数变化情况,以及微磨削加工参数对单晶硅加工后表面粗糙度的影响规律。建立微磨削槽磨未变形切屑厚度与试验试验加工过程中单晶硅微磨削力的关系,试验发现当未变形切屑厚度小于晶格常数时,微磨削力有随着未变形切屑厚度减小而增大的现象,为单晶硅微尺度磨削加工领域提供了理论参考与试验依据。

英文摘要：

Theoretical and experimental analysis on micro-grinding process of single crystal silicon has been investigated in this study. The mathematical model of undeformed chip thickness in slot micro-grinding of single crystal silicon has been built. Diamond tools in this experiment have been employed and slot micro-grinding experiments of single silicon are designed and carried out on a precise micro-machine tool. Influences of micro-grinding parameters to crack length are investigated from analysis of experiment results, the relationships between micro-grinding parameters to surface roughness and micro-grinding force during experiment have been revealed. The relationship between undeformed chip thickness and micro-grinding force results is built, it is found from experiment that the grinding force would increase with the decrease of undeformed chip thickness when the undefromed chip thickness is below lattice constant. It would provide research theory and experimental reference of material removal mechanism in micro-grinding of single crystal silicon.