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Improved circuit model for coplanar-waveguide to microstrip-line transition on silicon substrate
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相关项目:三维有线和无线互连结构模型研究
同期刊论文项目
三维有线和无线互连结构模型研究
期刊论文 17
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同项目期刊论文
Vertical topologies of miniature multispiral stacked inductors(代表论文3)
A wideband scalable and SPICE-compatible model for on-chip interconnects up to 110 GHz(代表论文1)
A Study of on-chip stacked multiloop spiral inductors(代表论文2)
Thermal transient response of GaAs FETs under intentional electromagnetic interference(IEMI)
Performance prediction of carbon nanotube bundle dipole antennas(代表论文5)
Frequency-thermal characteristics of on-chip transformers with patterned ground shields(代表论文6)
Electromagnetic-thermal characterization of on-chip coupled (a)symmetrical interconnects
Circuit modeling and performance analysis of multi-walled carbon nanotube(MWCNT) interconnects(代表论文4
Thermal effect simulation of GaN HFETs under CW and pulsed operation ground inductor at high tempera
Crosstalk prediction of single and double-walled carbon nanotube(SWCNT/DWCNT) bundle interconnects
Implementation of New CMOS Differential Stacked Spiral Inductor for VCO Design
Evanescent-mode bandpass filters using folded and ridge substrate integrated waveguides
On-chip dipoles in CMOS for wireless interconnect application