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Crosstalk prediction of single and double-walled carbon nanotube(SWCNT/DWCNT) bundle interconnects
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相关项目:三维有线和无线互连结构模型研究
同期刊论文项目
三维有线和无线互连结构模型研究
期刊论文 17
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同项目期刊论文
Vertical topologies of miniature multispiral stacked inductors(代表论文3)
A wideband scalable and SPICE-compatible model for on-chip interconnects up to 110 GHz(代表论文1)
A Study of on-chip stacked multiloop spiral inductors(代表论文2)
Thermal transient response of GaAs FETs under intentional electromagnetic interference(IEMI)
Performance prediction of carbon nanotube bundle dipole antennas(代表论文5)
Improved circuit model for coplanar-waveguide to microstrip-line transition on silicon substrate
Frequency-thermal characteristics of on-chip transformers with patterned ground shields(代表论文6)
Electromagnetic-thermal characterization of on-chip coupled (a)symmetrical interconnects
Circuit modeling and performance analysis of multi-walled carbon nanotube(MWCNT) interconnects(代表论文4
Thermal effect simulation of GaN HFETs under CW and pulsed operation ground inductor at high tempera
Implementation of New CMOS Differential Stacked Spiral Inductor for VCO Design
Evanescent-mode bandpass filters using folded and ridge substrate integrated waveguides
On-chip dipoles in CMOS for wireless interconnect application