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Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperatu
  • ISSN号：1350-4177
  • 期刊名称：Ultrasonics Sonochemistry
  • 时间：2014.5
  • 页码：924-929
  • 相关项目：Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
作者： Li, Zhuolin|Li, Mingyu|Xiao, Yong|Wang, Chunqing|
同期刊论文项目
Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
期刊论文 16 获奖 2
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