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Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current
  • ISSN号：0021-8979
  • 期刊名称：Journal of Applied Physics
  • 时间：2014.8.7
  • 页码：-
  • 相关项目：Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
作者： Cao, H. J.|Li, M. Y.|Wang, Y.|Liu, Z. Q.|
同期刊论文项目
Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
期刊论文 16 获奖 2
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