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Interfacial reactions of eutectic Sn3.5Ag and pure tin solders with Cu substrates during liquid-stat
  • ISSN号：0966-9795
  • 期刊名称：Intermetallics
  • 时间：2012.6
  • 页码：86-94
  • 相关项目：Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
作者： Yang, Ming|Li, Mingyu|Wang, Chunqing|
同期刊论文项目
Sn基钎料/Cu焊点界面单晶Cu6Sn5形态及其固态相变机理研究
期刊论文 16 获奖 2
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