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Directional solidification of Cu-20Sn alloy at low speed: From peritectic coupled growth to banding
  • ISSN号：0167-577X
  • 期刊名称：Materials Letters
  • 时间：0
  • 页码：1628-1631
  • 相关项目：包晶合金定向凝固过程中的共生生长与准共生生长机制
作者： Liu, Dongmei|Li, Xinzhong|Su, Yanqing|Luo, Liangshu|Zhang, Bo|Guo, Jingjie|Fu, Hengzhi|
同期刊论文项目
包晶合金定向凝固过程中的共生生长与准共生生长机制
期刊论文 31
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