中文摘要：

研究了电流密度、镀液温度及镀液pH对水溶液法在碳钢表面无氰镀铜时镀层质量、镀层外观及电流效率的影响。结果表明：在电流密度5A/dm2、镀液温度70℃、镀液pH=11条件下,碳钢表面铜镀层平整光亮,电流效率高,并且镀层与碳钢基体结合力良好。

英文摘要：

The effects of current density,temperature and plating solution pH on the quality and appearance of copper plating coat and on current efficiency of the cyanide-free copper plating were researched.The results show that at the conditions of current density of 5 A/dm2,plating solution temperature of 70 ℃,plating solution pH of 11,the copper plating coat on the surface of carbon steel is bright and smooth,the current efficiency is higher,the binding of copper plating coat with the carbon steel surface is good.