中文摘要：

采用AgCu共晶钎料钎焊SiO2陶瓷与TC4钛合金，形成了良好接头。通过扫描电镜（SEM），能谱分析（EDS）以及X射线衍射分析（XRD）明确了接头生成物，确定了接头界面结构为TC4／Ti2Cu＋Ti（s．s）／TizCu／TiCu＋TisCu4＋Ag（s．s）／Ag（s．s）＋Cu（s．s）＋Ticu／TiCu＋Cu2Ti4O／Al2（SiO4）O＋TiSi2／SiO2。研究了钎焊温度和保温时间对界面的影响，结果表明：当钎焊温度为850℃，保温时间为5min时，接头抗剪强度最高，其值为30MPa。

英文摘要：

SiO2 glass ceramic was successfully joined to TC4 alloy u filler foil by vacuum brazing. Joint interface was identified by sever EDS and XRD. The typical interface structure is TC4/Ti2 Cu ＋ Ti （s. s）/Ag（s, s） ＋Cu（s. s） ＋ TiCu/TiCu＋ Cu2Ti40/Al2 （SiO4）O＋ sing a commercially available AgCu al analysis methods, such as SEM, （s. s）/Ti2Cu/ TiCu＋Ti3Cu4 ＋Ag TiSi2/SiO2 from TC4 alloy to SiO2 glass ceramic side. The effect of brazing parameters on joint interface was studied. According to the experimental results, the joint brazed at 850℃ for 5min has the maximum shear strength of 30MPa.