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中文摘要：
随着功能器件互连导线的规模逐渐扩大,导线的尺寸不断减小,量子效应明显加强,未来将导致目前采用铜互连技术的微纳功能器件无法遵循传统半导体物理的原理工作。碳纳米管凭借其独特的一维纳米结构而具有优越的电学、热学及机械等性能,有望取代铜连线而成为下一代芯片的互连导线材料,而碳纳米管的互连技术则是结构制造、功能器件制备或其组装不可或缺的重要环节,现已成为国际新材料领域的研究前沿和热点,本文详细概述碳纳米管作为互连导线的优越性能、互连形式、互连技术的最新研究进展以及应用前景。
英文摘要：
The use of carbon nanotubes （CNTs） as conducting wires instead of copper wires for integrated circuits and very large scale integration has become more and more Important as their sizes are being scaled down and quantur~ effects become evident owing to their one-dimensional structure, excellent electrical, thermal and mechanical properties. Interconnect technologies for CNTs have become an important research activity in recent years and the latest research progress is summarized. Methods include localized nanoscale chemical vapor deposition, electron, ion and laser beam irradiations, atom force microscopy using field-induced evaporation and anodic oxidation, and dip-pen nanolithography in the AFM using dynamic exchange between tapping and lifting.
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