利用Thermecmastor-Z热模机对通过搅熔铸造-半固态等温热处理方法制备出的SiCp/AZ61复合材料半固态坯料进行触变压缩试验。分析了应变速率、变形温度以及SiC颗粒体积分数对压缩应力的影响。研究表明,SiCp/AZ61复合材料在半固态条件下的流动应力对变形温度和应变速率敏感,变形温度低,应变速率大,流动应力高。SiC颗粒增强相体积分数越大,流动应力越大。
Compression tests on semi-solid SiCp/AZ61 composites fabricated by the method of stir-casting and isothermal heat treatment were carried using the Thermecmastor-Z dynamic material testing machine. Influences of strain-rate, temperature, and the volume of SiC for the compressive stress were analyzed. The results show that the true stress of semi-solid SiCp/AZ61 composite is sensitive to temperature and strain rate. The true stress is higher with the increasing of the volume of SiC particulate.