中文摘要：

电子元器件和设备在工作时会耗散大量热量,影响电子元器件和设备的热可靠性。本文使用Icepak软件对翅片散热器进行数值分析,计算翅片散热器内部的流场和温度场,得到关键元件背板的温升,并探讨风扇风量、风扇位置、翅片厚度三个因素对背板温升的影响,得出背板温度随风扇风量的增大而降低、随风扇位置的不同而变化、随翅片厚度的增加而降低。得出降低背板温升的最优参数：3个风扇,风扇风量都是0.005kg/s,翅片厚度0.002m,并对优化结果进行分析。

英文摘要：

Electronic components and equipment dissipate large amounts of heat when working, which have effects on the thermal reliability of electronic components and equipment. This article numerically analyzes the fin heat sink using Icepak software, and calculates the flow field inside the radiator fins and temperature fields, to obtain the temperature of the key elements of back finned heat sink. The effects of three factors of fan air flow, fan location, fin thickness on the back fin heat sink. It is concluded that the temperature was reduced with the increased amount of wind; the temperature varies with the different position of fan and fan thickness.To summarize, the optimal parameters for reducing back finned heat sink which include three fans, 0.005 kg/s of fan air flow, 0.002m of fin thickness. In addition, the optimized results were analyzed.