中文摘要：

LED照明灯具由于本身体积小功率大,在工作时释放大量热量,影响其发光效率和使用寿命,散热问题一直是LED照明灯具的一个棘手问题。因此使用专门的热分析软件ANSYS Icepak对大功率LED照明灯具的散热问题进行探讨。通过数值模拟,探讨模型内的温度、速度和压力分布,以及基板的温度和压力云图,结果得出在初始风扇风速为0.005 kg/s,翅片厚度为0.018 m,翅片行间距为0.014 m时,LED关键元件基板的最高温度约为81.30℃,并得出风扇中心截面的温度、压力及速度的分布云图,以及该截面y方向中心线上的温度、压力及速度的变化曲线,反映了多排阵列大功率LED工作时的散热情况。

英文摘要：

The LED lighting lamps release great heat while working due to its small size and large power,which affects on the luminous efficiency and service life,so the heat dissipation problem is a thorny issue of LED lighting lamps all the time.The heat dissipation problem of high-power LED lighting lamps is discussed with thermal analysis software ANSYS Icepak. The temperature,velocity and pressure distribution in the model,and temperature and pressure contours of the substrate are discussed by means of numerical simulation. When the original fan flow rate is 0.005 kg/s,fin thickness is 0.018 m and fin rowspace is 0.014 m,the highest temperature of LED′s key element substrate is about 81.30 ℃. The temperature,pressure and velocity contours of the fans center section,as well as the temperature,pressure and velocity change curves of the center line along y direction are obtained,which reflect the heat dissipation situation of the multi-row array high-power LED while working.