中文摘要：

采用热压烧结制备Cu/V0.97W0.03O2复合材料。通过扫描电镜及能谱仪研究了该复合材料的组织形貌及成分组成,利用涡流电导仪测定不同V0.97W0.03O2含量的复合材料变温电导率,利用阿基米德排水法测量Cu/V0.97W0.03O2复合材料的密度,并采用硬度计测量Cu/V0.97W0.03O2复合材料的硬度。结果表明Cu/V0.97W0.03O2复合材料在0℃附近有电导率突变现象的发生,并且随着V0.97W0.03O2添加量的增加,该复合材料的电导率突变量也有所增加;热压烧结相较于无压烧结能够更好地提高Cu/V0.97W0.03O2复合材料的致密度及电导率。另外,随着V0.97W0.03O2添加量的增加,V0.97W0.03O2在Cu基体中的分散度得到改善,该复合材料的致密度增加,并可达97.1%,同时,其硬度逐渐增加。

英文摘要：

Cu/V0.97W0.03O2 composite was prepared by hot-pressing sintering method. The composition and surface microstructure were analyzed by SEM and EDS. The conductivity of composite with different V0.97W0.03O2-doping rates during temperature changing was tested by eddy current electric conductance meter. The density of Cu/V0.97W0.03O2 composite was tested by Archimedes drainage method. The hardness of Cu/V0.97W0.03O2 composite was measured by using hardness tester. The results indicate that Cu/V0.97W0.03O2 composite exhibit an abrupt change of conductivity when the temperature is near 0 ℃. The range of abrupt change increases with the amount of V0.97W0.03O2 increasing. Compared with the none-pressing sintering, the hot-pressing sintering can improve the compactness and conductivity of Cu/V0.97W0.03O2 composite efficiently. Meanwhile, the increase of V0.97W0.03O2-doping mass can improve the dispersion of V0.97W0.03O2 in Cu substrate. Meanwhile, the compactness of the composite increases and eventually could reach 97.1%,besides, the hardness increases gradually.