中文摘要：

传统单一粒径钨粉制备的铜钨（CuW）合金难以满足电容器开关中高频次开断电触头的使用要求,本研究采用3种粒径钨粉（超微米、微米和亚微米）级配法制备了新型CuW合金,利用场发射扫描电镜对CuW合金组织特征进行显微分析,并对新型CuW合金耐电弧击穿性能进行研究。结果表明,钨粉级配制备CuW合金,能形成多种W-W烧结颈,强化钨骨架,熔渗Cu相更分散更均匀,从而使得CuW合金硬度、电导率均高出国家标准30%~40%,且CuW合金耐电压强度较高,此外,新型CuW/CrCu整体材料结合强度高出国家标准40%~60%。

英文摘要：

Traditional CuW alloy prepared by tungsten powder with single particle size is difficult to meet the requirement of electrical contact of the high-frequency switching capacitor switch. In this paper,tungsten powders with three kinds of particle size（supermicron,micron and submicron） were used to prepare novel CuW alloy. The microstructure of the CuW alloy was analyzed by field emission scanning electron microscopy and the arc breakdown properties were investigated. The results show that CuW alloy prepared by grading tungsten powders can form a variety of W-W sintered necks,which strengthen tungsten skeleton; therefore,distribution of the Cu phase becomes more uniform and more dispersed. As a result,the hardness and electrical conductivity of the CuW alloy is 30%~40% higher than the national standard,and the CuW alloy has a higher resistance of voltage strength. In addition,the bonding strength of the CuW/Cr Cu prepared by grading tungsten powder is 40%~60% higher than the national standard.