中文摘要：

随着半导体技术的发展,封装集成度不断提高,迫切需要发展一种低温封装与键合技术,满足热敏器件封装和热膨胀系数差较大的同质或异质材料间的键合需求。针对现有整体加热封装技术的不足,首先介绍了局部加热封装技术的原理与方法,然后对电流加热、激光加热、微波加热、感应加热和反应加热等几种局部加热封装技术进行了比较分析,最后具体介绍了局部加热封装技术在热敏器件封装、MEMS封装和异质材料集成等方面的应用。由于局部加热封装技术具有效率高、对器件热影响小等优点,有望在MEMS技术、系统封装（SiP）、三维封装及光电集成等领域得到广泛应用。

英文摘要：

With increasing packaging integration of semiconductor devices,the low-temperature bonding and packaging technologies are critical for microelectromechanical system（MEMS）or thermal-sensitive microelectronics devices.Considering the shortages of the global heating for packaging,the principles and methods of localized heating packaging techniques are reviewed.Then several localized heating packaging technologies are discussed,such as the current heating,laser heating,microwave heating,induction heating and reactive heating.Finally,some applications of localized heating packaging techniques on thermal-sensitive devices packaging,MEMS packaging and heterogeneous integration are introduced to clarify their significant merit on future 3D packaging,system in package（SiP）and optoelectronic integration technology.