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中文摘要：
对纳米ZrO2牙科陶瓷磨削中脆性和塑性去除转变的材料去除机理进行了理论分析与实验研究。利用K—P36精密数控平面磨床对3Y—TZP纳米ZrO：牙科陶瓷进行磨削加工实验。用YDM—Ⅲ99型整体式三向压电磨削测力仪测量三向磨削力，用TALSURF5轮廓仪测量加工后的微观几何参数值，用扫描电镜观察表面微观形貌变化。实验结果表明，未变形磨屑的最大厚度小于1．9μm时为塑性去除方式；未变形磨屑的最大厚度为1．9～2．1／am时开始出现由侧向裂纹引起的脆性断裂去除，为塑性和脆性混合去除方式；未变形磨屑的最大厚度为5．23μm时，加工表面发生了大规模的脆性断裂，并且表面还残留了大量的半硬币形脆性断裂产生的凹坑，为脆性去除方式。
英文摘要：
Aiming at the theoretical analysis and experimental investigation on me crmcal conm- tions for the brittle-- ductile removal mechanism in nano-- ZrOz dental ceramic grinding, a K-- P36 nu- merical- control precision surface grinder was employed for the grinding test on 3Y--TZP nano-- ZrO2 dental ceramics. The YDM--Ⅲ99 integral three--dimensional piezoelectric grinding dynamome- ter was employed to measure three--dimensional grinding forces. The TALSURF5 contourgraph was used to measure the micro--geometrical parameters after the grinding, and a SEM was used to ob- serve the variation in the surface micromorphology. The experimental results indicate that the maxi- mal thickness of the undeformed chip thickness smaller than 1.9μm corresponds to the ductile removal mode. The brittle--fracture removal induced by side cracks appears when the maximal thickness of undeformed chip thickness is between 1.9 and 2. l;m, and the removal mode is brittle--ductile mixed removal. When the maximal thickness of undeformed chip thickness is as 5.23μm, large--scale brittle fracture appears at the grinding surface, and a large number of pits induced by the brittle fracture in half--coin shape remaines on the surface.
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