中文摘要：

为制造微流控芯片模具实现微流控芯片的大批量生产，采用三酸型蚀刻液对图案掩膜的P20模具铜进行蚀刻加工。观测蚀刻的微流道形状和尺寸，分析蚀刻深度、流道宽度、蚀刻因子和面粗糙度等随加工时间的变化规律。结果表明加工时间越长，微流道侧壁垂直性越好，蚀刻因子越大，但面粗糙度越差。因为反应产物附着于工件表面，特别是侧壁上，使侧向蚀刻速度低于深度方向蚀刻速度，而蚀刻反应产生热量，使工件反应表面温度升高，蚀刻速度加快，影响表面质量。蚀刻反应中，合理控制掩膜尺寸、加工时间、搅拌速度和反应温度等，才能得到满足要求的微流控芯片模具。

英文摘要：

For the manufacturing of microfluidic mold to achieve mass production of microfluidic chips, three-acid-based etchant was used to etchpattern masked P20 die steel. The shape and size of the etched micro-channel were observed. The change rules with processing time of etching depth, the channel width, etching factor and surface roughness were analyzed. The results showed that the longer the processing time, the better vertical the micro-channel sidewall, and the greater the etching factor, the worse the surface roughness. Because of the reaction product adhering to the surface, especially on the sidewall, lateral etching rate was lower than the etching rate in the depth direction. The etching reaction generated heat, so the temperature of workpiece surface raised, the etching speed, and then the surface quality was affected.