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Study on the thermal transient response of TSV considering the effect of electronic-thermal coupling
  • ISSN号：1598-1657
  • 期刊名称：Journal of Semiconductor Technology and Science
  • 时间：2015.6.1
  • 页码：356-364
  • 相关项目：云制造环境下多粒度服务访问控制方法研究
作者： Li, Chunquan|Zou, Meng-Qiang|Shang, Yuling|Zhang, Ming|
同期刊论文项目
云制造环境下多粒度服务访问控制方法研究
期刊论文 23 会议论文 7 专利 1 著作 1
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