位置：成果数据库 > 期刊 > 期刊详情页
Evaluating of adhesion property of ULSI interconnect films by the surface acoustic waves
  • 时间：0
  • 相关项目：表面波无损表征ULSI铜与低介电常数介质布线薄膜机械特性与粘附性的研究
同期刊论文项目
表面波无损表征ULSI铜与低介电常数介质布线薄膜机械特性与粘附性的研究
期刊论文 11 会议论文 5
同项目期刊论文
Applying surface acoustic waves technique for film adhesiveness determination
Determination of Young’s modulus and poisson’s ratio of nanoporous low-k thin film by laser-generate
Finite Element Model of SAW Method for Mechanical Characterization of Patterned Thin Films of the UL
声表面波标签中金属栅阵的耦合模理论
Young’s modulus characterization of low-k films of nanoporous Black DiamondTM by surface acoustic wa
LSAWs技术检测超薄low-k材料机械特性的匹配算法
Young’s modulus detection for ultra-thin film by LSAWs technique with wavelet and FIR filter de-nois
Young’s modulus evaluation by SAWs for porous silica low-k film with cesium doping
基于电荷分布的分裂指叉指换能器模型研究
Young＇s modulus characterization of low-k films of nanoporous Black Diamond~（TM） by surface acoustic waves