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Transient Electrothermal Analysis of Multilevel Interconnects in the Presence of ESD Pulses Using th
  • ISSN号：0018-9375
  • 期刊名称：Ieee Transactions On Electromagnetic Compatibility
  • 时间：0
  • 页码：774-783
  • 相关项目：复杂舰船平台中通信系统的电磁环境效应机理研究
作者： Yan-Bing Shi|Wen-Yan Yin|Jun-Fa Mao|Peiguo Liu|Qing Huo Liu|
同期刊论文项目
复杂舰船平台中通信系统的电磁环境效应机理研究
期刊论文 23 会议论文 21
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