中文摘要：

利用从瞬态热响应曲线中解析出的包含热阻、热容的结构函数，对大功率发光二板管（LED）传热路径上的热结构特性进行了分析。结果表明，用该方法不仅能得到器件结到环境的总热阻，更为重要的是还可从结构函数曲线图上直观地对器件各结构层的热阻进行分析，且测量重复性好，从而为评价器件的封装质量、散热性能提供直接、可靠的依据。

英文摘要：

As a novel evaluation method, structure function, extracted from the real time thermal transient measurement, was employed to analyze the thermal resistance of power light- emitting diode（LED）. Both the thermal resistance of junction to the ambient and those of different layers in the heat-flow path can be obtained from the structure function curves. Based on this heat-flow path map, the package quality and defect location of the device can be evaluated directly and reliably.