针对循环生产的半导体双产品制造过程提出了一种新的控制方法.此方法采用前面批次的参数估计机台漂移,机台干扰由前馈和未来批次的反馈控制综合决定.得到了系统输出和其渐进期望方差误差,并证明了渐进期望方差误差与不同产品的间隔无关.仿真结果表明这种方法是有效的.
A novel control approach which deals with two product process in semiconductor manufacturing industry is presented. It eatimates the patterned tool drift by the data acquired in the previous run. The patterned tool disturbance is obtained by combination of feed-forward and the feedback control for the consecutive runs. The output and AMSE(asymptotic mean square error) are given. And it is proved that its AMSE is irrelated with the interval of the different products. The simulation results show that this approach is valid.