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Thermoelastic stress analysis of multilayered films in a micro-thermoelectric cooling device

ISSN号：0567-7718
期刊名称：《力学学报：英文版》
时间：0
分类：O484.43[理学—固体物理;理学—物理] TB33[一般工业技术—材料科学与工程]
作者机构：[1]Key Laboratory of Mechanics on Environmentand Disaster in Western China,, [2]The Ministry of Education of China,, [3]College of Civil Engineering and Mechanics,Lanzhou University, 730000 Lanzhou, China
相关基金：supported by the National Basic Research Program of China(2007CB607506);the Fok Ying-Tong Education Foundation for Young Teachers in the Higher Education Institutions of China(111005);the Foundation for Innovative Research Groups of the National Natural Science Foundation of China(11121202)

作者： Yu-Mei Yang, Xing-Zhe Wang, Wen-Jie Zhang

关键词：热弹性应力, 冷却装置, 热电式, 应力分析, 微型, 多层膜, 解析表达式, 热电装置, Thermoelectric cooling device , Multilayeredthin-film , Thermoelastic stress - Analytical solution

中文摘要：

这份报纸在在不同操作下面的薄电影的微热电的冷却设备调节的一架典型在里面飞机为 thermoelastic 压力论述一个分析答案。在 multilayered 的可允许的温度地的分布薄电影包括最大的温度差别和热电的设备的最大的使冷输出，获得的经分解，和特征为二个操作条件被讨论。thermoelastic 压力在的分析表达式分层热电薄电影由温度差别导致了基于多层的系统的理论被提出。结果表明那，几何尺寸是显著地影响 thermoelastic 压力的一个重要因素。在半导体热元件的层的压力分布，绝缘并且支持的膜表演显然不同的特征。现在的工作可以有利地指导高效率的微热电的冷却设备的优化设计。

英文摘要：

This paper presents an analytical solution for the thermoelastic stress in a typical in-plane＇s thin-film micro- thermoelectric cooling device under different operating con- ditions. The distributions of the permissible temperature fields in multilayered thin-films are analytically obtained, and the characteristics, including maximum temperature dif- ference and maximum refrigerating output of the thermo- electric device, are discussed for two operating conditions. Analytical expressions of the thermoelastic stresses in the layered thermoelectric thin-films induced by the tempera- ture difference are formulated based on the theory of mul- tilayer system. The results demonstrate that, the geometric dimension is a significant factor which remarkably affects the thermoelastic stresses. The stress distributions in layers of semiconductor thermoelements, insulating and support- ing membrane show distinctly different features. The present work may profitably guide the optimization design of high- efficiency micro-thermoelectric cooling devices.

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