中文摘要：

通过CVD-浮动辅助催化法在Si基底上制备了管径约为80 nm、高度400～500μm的碳纳米管阵列膜,将其和环氧树脂进行复合,同时添加了二丁酯作为增韧剂,固化得到了环氧树脂复合碳纳米管阵列热界面材料。并测量了热界面材料的拉伸力学、导电、导热性能。结果表明：加入增韧剂提高了复合材料的拉伸延展性,当增韧剂的质量份额为20%时,其拉伸延展性最好;电导率随着增韧剂含量的增加而逐渐减小;当增韧剂的质量份额为10%时,导热系数为12.5W/（m·K）,随着增韧剂含量的增加导热系数有所减小。

英文摘要：

Carbon nanotube arrays were fabricated via floating catalyst chemical vapor depo- sition（CVD）, with diameter about 80 nm and height of 400-500 μm. Epoxy was designed to composite with carbon nanotube arrays for preparing CNTAs/epoxy composite films. Further, DBP as a toughen agent was added into epoxy polymer before compositing in order to make CNTAs/epoxy composite films infiltrated better, less space and more flexibility. When DBP weight percent was 10%, the thermal conductivity of CNTAs/epoxy composite films was 12.5 W/（m.K）, and with DBP percent increased, the thermal conductivity and electric properties decreased because of its low thermal conductivity and density. 20% of DBP was a turning point that has the best ductility.