中文摘要：

脆性材料的研磨过程会不可避免地产生亚表面损伤层,对亚表面损伤层的表征和抑制一直是获得高激光损伤阈值熔石英光学元件的关注热点。回顾了几种亚表面有损表征技术,通过实验重新评价了蚀刻表面峰谷（PV）粗糙度法的可行性,分析了其误差较大的原因。在此基础上,提出了一种新的亚表面损伤层深度检测方法——HF蚀刻＋逐层抛光法。分别采用这两种表征技术以及粗糙度估计法、磁流变斜面抛光法对不同工艺研磨的熔石英亚表面裂纹深度进行了对比检测,结果表明这几种表征方法相互符合很好。

英文摘要：

Subsurface damage would be inevitably formed during grinding of brittle material.The characterization and removal of the subsurface damage remains the main concern to acquire the high laser-induced damage threshold fused silica optics.Several subsurface damage characterization techniques are revieved,in which the feasibility of etching and surface peak-to-valley（PV） roughness method is revaluated experimentally and the error is also analyzed.Herein a new subsurface damage characterization using HF etching and polishing layer by layer is proposed.Then,these subsurface damage characterization techniques are compared in applying to ground fused silica samples.And a good concordance between different measurements is found.