中文摘要：

高功率半导体激光器及其阵列具有体积小、质量轻、能耗低、光斑易调节、光电转换效率较高的优点,广泛应用于金属材料焊接、金属表面相变硬化和金属材料表面熔覆。利用高功率半导体激光器可以连续性焊接不同型号的合金钢,获得大面积深度均匀的相变硬化层,也能够精确控制熔覆层结构及其几何形状。

英文摘要：

High power semiconductor laser has a series of advantages,such as small size,light weight,low energy consumption,adjustable beam spot,high quantum efficiency,and high electro-optical efficiency.It has been widely used in material welding,surface hardening,cladding and engineering material surface processing.By using the high-power semiconductor laser,we can continuously join alloy steels of different type,easily obtain large area of phase change layer and accurately control the shape of cladding layer.