中文摘要：

使用准连续介质法模拟了镍楔形光滑压头与光滑／多粗糙峰铜基体之间的多尺度纳米接触过程，研究了两模型接触过程中位移一载荷、位移一接触面积关系和基体的变形机制．结果显示粗糙峰能有效地减小粘着力，粗糙峰对接触的初始阶段影响大，该阶段的变形主要为粗糙峰的变形．随着压头位移的增加，粗糙峰对载荷和纳米接触问题的影响也随之逐渐减小．

英文摘要：

Muhiscale simulations of nanocontact between Ni indenter and single crystal Cu substrate with smooth surface and multi-asperity surface are carried out with the quasicontinuum method. The curves of contact force vs. displacement and con- tact radius vs. displacement as well as the deformation mechanism in Cu substrate are investigated during the contact process. It is found that the asperities can reduce the adhesive force effectively. The asperities play an important role in the initial stage of the contact process and deformation mainly occurs in asperities during this stage. The influence of surface roughness on nanocontact problem gradually decreazes with the increase of indenter displacement.