中文摘要：

采用微生物法和化学沉积法在直径为0．4-0．6μm的诺卡氏（Nocadia）菌体表面成功沉积了厚度约为200 nm、晶粒尺寸约为20 nm的Cu镀层,制备出新型Cu微米杆材料．在相同条件下,十二烷基苯磺酸钠对菌体的分散效果好于焦磷酸钠．在表面活性剂十二烷基苯磺酸钠和机械搅拌联合分散下,菌体均匀分散在前处理溶液和镀铜液中．施镀过程中,菌体保持原有形状,得到了纳米Cu晶粒组成的微米级杆状金属材料．

英文摘要：

Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia （0.4-0.6 μm in diameter） surface were prepared by microbiological method and electroless deposition technology. It was found that the dispersion state of Nocadia in C18H29NaO3S aqueous is better than that in Na4P2O7 aqueous under the same other conditions. Nocadia dispersed in pre-processes solutions and electroless plating solutions on the synergistic action of C18H29NaO3S and agitation. Nocadia remained their original rod shape during the electroless plating process. Copper micro rod material with nano grain was obtained.