中文摘要：

采用高能球磨法将Cu粉和Al2O3粉混合;通过调节球磨时间,保证Al2O3粉细小而弥散分布在Cu的基体中。通过扫描电镜研究了球磨时间对Al2O3颗粒形貌与分布的影响,XRD研究了球磨时间对Cu晶粒细化和晶格畸变的影响,金相显微镜研究了球磨时间对金相组织的影响,研究了球磨时间对力学性能和导电率的影响,并计算了相对密度。结果表明：当球磨转速为270r/min、球磨15h时,Al2O3颗粒细小,分布较为均匀,且其抗压强度最高为565MPa,导电率34%IACS;随球磨时间增加,XRD表明Cu晶粒细化和晶格畸变增加,金相组织显示晶粒从片层状逐渐变为球状。

英文摘要：

Alumina powder and copper powder were mixed by high energy milling,to ensure alumina powder fine and homogeneous in copper matrix by changing milling time.Alumina dispersion strengthened copper matrix composite was studied by scanning electron microscope,X-ray diffraction and metallographic microscope.Mechanical property,and the densification was studied.The result show that alumina powder is fine and homogeneous in copper matrix with speed of 270r/min after 30 hours milling,average particle size of alumina is 100-200nm,and the maximum compressive strength is 565MPa.By extending the milling time,the grain refines and lattice distortion increases,the shape of copper changes from lamination,to near-sphericity.