中文摘要：

采用非等温示差扫描量热法（DSC）研究了E-12/双氰胺（固化剂）和E-12/双氰胺/2-甲基咪唑（促进剂）体系的固化反应动力学。采用Kissinger法和Crane公式对DSC数据进行处理,获得了固化反应动力学参数,应用热重分析（TGA）研究了固化产物的热稳定性。结果表明：双氰胺、2-甲基咪唑的最佳用量分别为环氧树脂质量的4%和0.4%,最佳固化条件为160℃/15min。E-12/双氰胺体系和E-12/双氰胺/2-甲基咪唑体系的表观活化能分别为105.12kJ/mol和70.62kJ/mol,固化反应级数n=0.92。起始分解温度约为410℃,促进剂2-甲基咪唑的加入对体系热稳定性没有影响。

英文摘要：

The curing reaction kinetics of E-12 /dicyandiamide（ curing agent） and E-12 /dicyandiamide/2-methylimidazole（ accelerator） systems were studied by DSC. The Kissinger method and Crane formula were used for DSC data processing and the kinetic parameters of curing reaction were determined. The thermal stability of cured product was investigated by thermal gravimetric analysis（ TGA）. The results showed that the optimum amounts of dicyandiamide and 2-methylimidazole were 4% and 0. 4% （ based on the epoxy weight） repectively and the optimum curing condition was 160 ℃ /15 min. The apparent activation energy of E-12 /dicyandiamide system and E-12 /dicyandiamide/2-methylimidazole system were 105. 12 kJ/mol and 70. 62 kJ/mol respectively. The curing reaction order n was 0. 92. The initial decomposition temperature of the two systems was about 410 ℃ and the adding of 2-methylimidazole had little effect on the thermal stability of the system.