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Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow
  • ISSN号：0957-4522
  • 期刊名称：Journal of Materials Science: Materials in Electro
  • 时间：2013.1.1
  • 页码：217-223
  • 相关项目：全IMC焊点界面反应机理及微观力学行为研究
作者： Wei Liu|Yanhong Tian|Chunqing Wang|Lining Sun|
同期刊论文项目
全IMC焊点界面反应机理及微观力学行为研究
期刊论文 10 会议论文 2 获奖 1 专利 3
同项目期刊论文
Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air
Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joint
Surface Tension Driven Self-assembly of 3-D Microcomponents Using Laser Reflow Soldering Method and
Evolution of AuSnx Intermetallic Components in Laser Reflowed Micro-Solder Joints
高斯分布激光前向转印Cu薄膜形貌及机理研究
高斯分布激光散焦距离对转印Cu薄膜形貌影响及机理分析
高斯分布激光散焦距离对激光转印Cu薄膜形貌影响及机理分析
高斯分布激光前向转印Cu薄膜形貌及机理
Evolution of AuSnx intermetallic compounds in laser reflowed micro-solder joints