中文摘要：

用磁控共溅射法制备含铌1.16%～27.04%（原子分数）的Cu-Nb合金薄膜,运用EDX,XRD,SEM,TEM,显微硬度仪和电阻仪对沉积态和热退火态薄膜的成分、结构和性能进行了研究。结果表明,Nb添加显著影响Cu-Nb合金薄膜微结构,使Cu-Nb薄膜晶粒细化,含铌1.82%～15.75%的Cu-Nb膜呈纳米晶结构,存在Nb在Cu中的fcc Cu（Nb）非平衡亚稳过饱和固溶体,固溶度随薄膜Nb浓度增加而上升,最大值为8.33%Nb。随Nb含量增加,薄膜中微晶体尺寸减小,Cu-27.04%Nb膜微结构演变至非晶态。与纯Cu膜对比表明,Nb添加显著提高沉积态Cu-Nb薄膜显微硬度和电阻率,总体上二者随膜Nb含量上升而增高。Nb含量高于4.05%时显微硬度增幅趋缓,非晶Cu-Nb膜硬度低于晶态膜,电阻率则随铌含量上升而持续增加。经200,400及650℃退火1h后,Cu-Nb膜显微硬度降低、电阻率下降,降幅与退火温度呈正相关。XRD和SEM显示,650℃退火后晶态Cu-Nb膜基体相发生晶粒长大,并出现亚微米级富Cu第二相,非晶Cu-27.04%Nb膜则观察到晶化转变和随后的晶粒生长。Nb添加引起晶粒细化效应以及退火中基体相晶粒度增大是Cu-Nb薄膜微观结构和性能形成及演变的主要原因。

英文摘要：

The composition,structure,properties of Cu-Nb alloy thin films with Nb content of 1.16% ～27.04%（atom fraction） prepared by magnetron co-sputtering were investigated by EDX,XRD,TEM,SEM,microhardness instrument and resistivity meter in the condition of as-deposited and post-annealed states.The results showed that the microstructure of Cu-Nb alloy thin films was influenced by Nb addition significantly and adding Nb led to grain refinement.Cu-Nb thin films with 1.82% ～15.75%Nb possessed nanocrystalline structure with the presence of fcc Cu（Nb） non-equilibrium metastable supersaturated solid solution,and the Nb solubility increased with the incremental Nb concentration and maximum Nb solubility of 8.33%.The size of the microcrystal in Cu-Nb thin films decreased as the Nb content increased,and the microstructure of Cu-27.04%Nb thin films evolved to amorphous state.Comparison with pure Cu films,it could be found that the microhardness and electrical resistivity values of as-deposited Cu-Nb thin films significantly adding Nb,generally both of them were improved with the incremental Nb content in the films.The increment extent in the microhardness was flattened when Nb content was over 4.05%,and the microhardness of amorphous Cu-Nb thin films were lower than crystalline counterparts,but the resistivity increased continuously with Nb content.The microhardness and resistivity decreased after annealed at 200,400 and 650 ℃ for 1 h.The reduction extent in the microhardness and resistivity had positive correlation with annealing temperature.XRD and SEM analysis revealed coarseness in the grain sizes of the matrix phases of Cu-Nb films and the appearance of submicron Cu-rich second-phase,crystalline transition and subsequent grain growth were observed for amorphous Cu-27.04%Nb films after 650 ℃ annealed.It was considered that the formation and evolution of the microstructure and the properties of Cu-Nb thin films could be mainly attributed to the grain refining effect caused by Nb addition as well as the growth o